Semiconductor

Detecting wafer notch position with a 2D laser profiler eliminates the risk of missing the notch when the wafer is slightly warped.

The pitch of the saw wires can vary with temperature and the form of the main roller. Regular pitch measurement makes it easy to see when to replace rollers.

Reduce reactive maintenance by inspecting dicing blade thickness at regular intervals. By checking more often, you can detect chipped edges in the thin blades prior to breakdown. By opposing two confocal sensors, you can reliably measure thickness around the blade edge without causing damage.

By monitoring the home position of the end effector, you can detect minute changes before they cause a collision between the wafer and wafer carrier. Using a long range displacement sensor enables end effector position measurement through a viewport.

Measure the profile of a wafer edge. By selecting one of the inspection tools such as Height Difference/Width or Angle, users can start measurement easily. The high-resolution image capturing using 3200 points/profile achieves highly accurate profile measurement that was impossible with conventional methods.

Thanks to the small head size, CL-3000 Series devices can be easily installed on equipment for accurate distance measurement. The sensor can measure both diffuse and mirrored surfaces accurately, without any mounting adjustments.

The special sensor head fixture combined with the optical-axis alignment function makes high-accuracy thickness measurement easy to perform for all targets. This allows for stable measurement even for wafers with rough surfaces.

Highly glossy grooves can be difficult to inspect using non-contact measuring instruments due to diffuse reflections and other factors. The LJ-X Series, however, includes unique functions that can suppress such effects for stable shape measurement.